Boron is a chemical element with symbol B and atomic number 5. Boron is concentrated on Earth by the water-solubility of its more common naturally occurring compounds, the borate minerals. These are mined industrially as evaporites, such as borax and kernite. The largest known boron deposits are in Turkey, the largest producer of boron minerals.
Boron is widely used in ion implantation and thin film applications. For example, boron ions are used for ion-beam doping of semiconductors, for surface modification by ion implantation, for synthesizing boron-containing films and coatings such as boron nitride, and for trench filling in particle detectors.
Boron-based coatings can significantly improve the surface properties of the materials for diverse applications since the coatings exhibit high hardness, toughness, corrosion resistance, and wear resistance, and extreme case rival properties of diamond. For all these reasons, being able to sputter boron is highly relevant, and for many applications especially interesting when a conventional planar magnetron can be used.
The most common method of producing boron-containing coatings with a planar magnetron is to use a target of a boron-containing compound, where the non-boron component is used to directly obtain the desired boron compound film, and/or utilize the target’s electrical conductivity that comes with the addition of the component.
Magnetron targets made of pure boron have been mainly used in semiconductor doping technology as well as to deposit boron nitride films by reactive magnetron sputtering, when the pure boron target operates in a nitrogen atmosphere. You may get more detailed information about sputtering of pure boron using a magnetron without a radio-frequency supply from the link given below:
You may reach out our boron sputtering target products from the link given on the table below.
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