Nanografi Nanotechnology

The main insulating material used in micro-technology is Silicon Dioxide, which in chemical symbols is written as SiO2. In semiconductor technology, SiO2 thin film layers are mainly used as dielectric material film in transistors, capacitors (DRAM) or flash-memories. Silicon Oxide Wafers are produced using crystallization, solid state and other ultra-high purification processes such as sublimation. This process forms a cylindrical ingot, which is then sliced and polished to form wafers. Thermal oxide is a kind of "grown" oxide layer, compared to CVD deposited oxide layer, it has a higher uniformity, and higher dielectric strength, it is an excellent dielectric layer as an insulator . In most silicon- based devices, thermal oxide layer play an important role to pacify the silicon surface to act as doping barriers and as surface dielectrics. The simplest way to produce an insulating silicon oxide layers (SiO2) on silicon wafers is to oxidize silicon with oxygen, which ...