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Showing posts with the label SILVER CONDUCTIVE ADHESIVE PASTE AND APPLICATIONS

Silver Conductive Adhesive Paste and Applications

Electrically conductive adhesives are composites of polymeric matrices and electrically conductive fillers. The polymeric resin, such as an epoxy, a silicone, or a polyimide, provides physical and mechanical properties such as adhesion, mechanical strength, impact strength, and the metal filler (such as, silver, gold, nickel, or copper) conducts electricity. Metal-filled thermoset polymers were first patented as electrically conductive adhesives in the 1950s. Recently, electrically  conductive adhesive  materials have been identified as one of the major alternatives for lead-containing solders for microelectronics packaging applications. Electrically conductive adhesives offer numerous advantages over conventional solder technology, such as environmental friendliness, mild processing conditions which enable the use of heat-sensitive and low-cost components and substrates, fewer processing steps which reduce processing cost, low stress on the substrates, and fine-pitch inter...