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Showing posts with the label FUSED SILICA WAFERS

Fused Silica Wafers Types and Their Applications

Fused Silica Wafers are thin, circular pieces of UV fused silica originally designed for the use as test substrates to measure the quality of optical coatings. Fused Silica also sometimes called “Fused Quartz” is the amorphous phase (glassy form) of quartz (SiO2) and is thus isotropic. It is tough and hard and has a very low expansion. It has no additives, unlike e.g. borosilicate glass, thus is pure SiO2. Fused silica has higher transmission in the ultraviolet and infrared spectrum, a superior chemical resistance and high dielectric strength, a very low thermal expansion coefficient and a high softening point and high thermal resistance. Standard thicknesses of fused silica wafers are 500, 700 and 1000 μm with diameters of 2, 3, 4 and 6 inches. Production process of fused silica mainly consists of the method of melting and re-solidifying of ultrapure SiO2. Silicon-rich chemical precursors such as SiCl4 are used for synthesis of fused silica by the process of gasifying and oxidizi...