- Aluminum nitride (AlN) was first synthesized in 1877, but it was not until the middle of the 1980s that its potential for application in microelectronics was realized.
- In the technical ceramics family, Aluminum nitride is a newer material.
- Aluminum nitride has a hexagonal crystal structure.
- Aluminum nitride is a covalent bonded material.
- Aluminum nitride nanopowder/nanoparticle has good dielectric properties and high thermal conductivity.
- Aluminum nitride is stable in hydrogen and carbon dioxide atmospheres up to 980°C.
- Aluminum Nitride nanopowder/nanoparticle uses substrates for electronic packages and heat sinks.
- Aluminum Nitride nanopowder/nanoparticle uses power transistor bases.
- Aluminum Nitride nanopowder/nanoparticle uses semiconductor processing chamber fixtures and insulators.
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Titanium carbide which has the chemical formula of TiC attracted great interest for many structural applications due to its extremely high melting temperature, high hardness, high chemical resistance and good electrical conductivity. Therefore titanium carbide can be used in cutting tools, grinding wheels, wear-resistant coatings, high temperature heat exchangers, magnetic recording heads, turbine engine seals, and bullet-proof vests, etc. In addition, a promising field of application comprises plasma and flame spraying processes in air, where titanium carbide-based powders show high-phase stability. TiC(Titanium Carbide Powder) (325 mesh, 99,9+%) can also be used in biomedical implant devices. Materials used for biomedical implant devices must satisfy a variety of property demands, which are often mutually exclusive. Further, different parts of a device demand different material properties. These factors often make it difficult to manufacture a medical device using a...
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