* The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning
* Finally the individual microcircuits are separated (dicing) and packaged.
* Finally the individual microcircuits are separated (dicing) and packaged.
* One process for forming crystalline wafers is known as Czochralski growth invented by the Polish chemist Jan Czochralski.
* In this process, a cylindrical ingot of high purity mono crystalline semiconductor, such as silicon or germanium, called a boule, is formed by pulling a seed crystal from a 'melt'.
* Donor impurity atoms, such as boron or phosphorus in the case of silicon, can be added to the molten intrinsic material in precise amounts in order to dope the crystal, thus changing it into n-type or p-typeextrinsic semiconductor.
https://en.wikipedia.org/wiki/Wafer_(electronics)
https://nanografi.com/silicon-wafers/
https://nanografi.com/blog/what-is-the-silicon-wafer/
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